Master Bond Launches New Highly Thermally Conductive Epoxy System
15 December 2010
Master Bond has developed a highly thermally conductive epoxy system that is specially designed to help mitigate the issues associated with tightly packed components and miniaturized electronic circuits. With a thermal conductivity over 22BTU/in/ft²/hr/°F and serviceability from -60°F - 400°F, Master Bond EP21ANHT delivers outstanding performance in the most demanding microelectronic applications. The cured adhesive is also a superior electrical insulator, further expanding its usefulness.
This two component adhesive, sealant, and coating has a convenient one to one mix ratio by weight or volume and offers room temperature and faster elevated temperature cures. EP21ANHT has a low coefficient of thermal expansion of 18in - 20in x 10-6°C, a dielectric strength of >400V/ml, and a tensile shear strength greater than 1,000psi. It resists a wide range of chemicals and adheres well to a variety of substrates.
EP21ANHT is available in pint, quart, gallon and five-gallon kits.
Master Bond thermally conductive epoxy systems
Master Bond EP21ANHT thermally conductive epoxy system delivers outstanding heat transfer and high-temperature resistance. Read more about Master Bond's thermally conductive epoxies on our website.
